发明名称 HEAT SINK
摘要 PROBLEM TO BE SOLVED: To engage a fin part 1 efficiently with a base surface 3 completely without collapsing the tips of protruding parts A on the right and left of a pressure transmitting fin of the fin part 1, in a heat sink manufactured by engaging the fin part 1 by press fit with the base surface 3. SOLUTION: In the heat sink constituted by the base surface 3 to be mounted with a semiconductor and the fin part 1 for radiating the heat from the base surface 3, by utilizing an engaging method for engaging the fin part 1 with the base surface 3 by applying the pressure to the protruding parts A on both the right and left sides of the fin part 1, a level difference d is provided to the protruding parts A on both the right and left sides, so that a length Fs of the A part of the fin part 1 receiving the pressure by an engaging jig at engaging is in a range from a half of a length Sp1 between the fin parts to almost the same length as the Sp1. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007251113(A) 申请公布日期 2007.09.27
申请号 JP20060112683 申请日期 2006.03.17
申请人 TOUSUI LTD 发明人 TERADA ATSUSHI
分类号 H01L23/36 主分类号 H01L23/36
代理机构 代理人
主权项
地址