| 摘要 |
PROBLEM TO BE SOLVED: To efficiently execute chamfering work in a short time without the risk of wafer breakage and to improve productivity. SOLUTION: By including cutting processes (d) and (e) of projecting a region equivalent to the thickness (t) of a wafer W from the end face 1a of an ingot 1, cutting it with a band saw 7, and cutting out the wafer of a prescribed thickness and chamfering processes (b) and (c) of executing the chamfering work to the outer periphery of the region equivalent to the thickness (t) of the wafer W by a metal bond wheel 22 before cutting out the wafer W from the ingot 1, the chamfering work is executed to the outer periphery of the wafer W to be cut out in the stage of the ingot 1 beforehand. COPYRIGHT: (C)2007,JPO&INPIT
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