<p>Disclosed is an epoxy resin curable composition for use in a prepreg, wherein the composition comprises the following components (A) to (E): (A) a polyamide compound which has a structure derived from an aromatic diamine having a phenolic hydroxyl group and has the phenolic hydroxyl group at a position adjacent to an amino group; (B) an epoxy resin; (C) an epoxy resin-curing agent; (D) a filler; and (E) a solvent.</p>
