| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive resist composition for thick-film resist film formation, capable of reducing viscosity and forming a thick-film resist film of 1-15 μm film thickness, having proper in-plane uniformity of film thickness, and to provide a thick-film resist laminate and a resist pattern forming method using the positive resist composition. <P>SOLUTION: The positive resist composition for thick-film resist film formation in 1-15 μm film thickness is prepared, by dissolving in an organic solvent (S) a resin component (A), of which the alkali solubility increases under the action of an acid and an acid generator component (B) which generates acid upon exposure to light, wherein the organic solvent (S) is a mixed solvent that is 10-95 mass% of propylene glycol monomethyl ether and 5-90 mass% of another solvent (S2). <P>COPYRIGHT: (C)2007,JPO&INPIT |
