| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To simultaneously perform both soldering to caps and preliminary soldering of connecting lands so that the preliminary solder height is uniform. <P>SOLUTION: Caps 5 house mounted components 14 on a circuit board 1, engaging parts 6 of the caps 5 are connected to the board 1 and engaged with the inner sides of conductive through-holes 2 of the board 1, and connecting lands 13 conductive to the through-holes 2 are formed on the opposite surface of the board 1 to the component mounting surface. The lands 13 are each sectioned by an insulating member 3a on the same land into a cap connecting land region 13a for soldering to the engaging part 6 and an outside connecting land region 13b for connecting to the outside. The cap connecting land region 13a is soldered 9 to the engaging part 6 and preliminary solders 8a, 8b are formed on the surface of the outside connecting land region 13b. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
