| 摘要 |
An electronic component includes at least one vertical MOSFET device, a leadframe and a contact clip. A source electrode and gate electrode are provided on a lower surface of the MOSFET device and are mounted on a source portion and a gate portion, respectively, of the leadframe. The contact clip is electrically connected between the drain electrode, which is positioned on the upper surface of MOSFET device, and a drain portion of the leadframe.
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