发明名称 |
PACKAGING METHOD OF CHIP OR PACKAGE EQUIPPED WITH BUMPS |
摘要 |
<p>To provide a packaging method that connects a semiconductor chip and a substrate through an under-fill material and after an operation confirmation test is conducted, the under-fill material is heat cured. A packaging method of a semiconductor chip or package equipped with bumps, comprises the steps of arranging a heat-fluidizing and thermosetting under-fill material film between a semiconductor chip or package equipped with bumps and a substrate; applying heat and pressure at a temperature and a pressure sufficiently high to cause fluidization of the under-fill material film and to achieve provisional electrical connection; conducting an operation confirmation test; and if the operation confirmation test proves successful, further heating and curing the under-fill material film to obtain the final electronic device, or if the operation confirmation test proves unsuccessful, removing a defective chip or package at a temperature and a pressure sufficient to cause fluidization of the under-fill material film, and repeating the steps described above by using a new chip or package equipped with bumps.</p> |
申请公布号 |
WO2007109428(A2) |
申请公布日期 |
2007.09.27 |
申请号 |
WO2007US63540 |
申请日期 |
2007.03.08 |
申请人 |
3M INNOVATIVE PROPERTIES COMPANY;KAWATE, KOHICHIRO;KAWATE, YOSHIHISA;LOTTES, ANDREW, C. |
发明人 |
KAWATE, KOHICHIRO;KAWATE, YOSHIHISA;LOTTES, ANDREW, C. |
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