发明名称 PHOTOSENSITIVE COMPOSITION, METHOD FOR FORMING PATTERN USING THE SAME, AND CHEMICAL COMPOUND
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive composition having an improved exposure latitude and pattern shape in normal exposure and in liquid immersion exposure and an improved sensitivity and dissolution contrast in EUV light exposure for use in a semiconductor manufacturing process, a process for manufacturing a circuit board used for a liquid crystal, a thermal head or the like and a photo-fabrication process other than the above, a pattern forming method using the photosensitive composition, and a chemical compound of a specific structure constituting the photosensitive composition. <P>SOLUTION: A photosensitive composition comprising a chemical compound of a specific structure, a pattern forming method using the photosensitive composition, and a chemical compound of a specific structure constituting the photosensitive composition are disclosed. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007246485(A) 申请公布日期 2007.09.27
申请号 JP20060075533 申请日期 2006.03.17
申请人 FUJIFILM CORP 发明人 WADA KENJI
分类号 C07D285/00;C07D513/08;G03F7/004;G03F7/039;H01L21/027 主分类号 C07D285/00
代理机构 代理人
主权项
地址