SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device of MCP constitution which has simple constitution and is improved in mass productivity, and to provide its manufacturing method. SOLUTION: A first semiconductor chip is mounted on a mount substrate. A second semiconductor chip which operates while being combined with the first semiconductor chip is mounted on the first semiconductor chip. The second semiconductor chip is disposed while a plurality of groups of bonding pad arrays connected to the same internal node in common are dispersedly provided at four sides. One of the plurality of bonding pads connected in common among the plurality of groups is selected and connected corresponding to the arrangement of bonding pads of the first semiconductor chip to be connected or leads provided to the mount substrate. COPYRIGHT: (C)2007,JPO&INPIT