| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive composition capable of making a die attach at low pressures and giving a void-free cured product of the composition. <P>SOLUTION: The adhesive thermosetting composition comprises (A) an organopolysiloxane resin and (B) a curing catalyst; wherein the organopolysiloxane resin A has two or more alkenyl groups per molecule, 10-99% of the total number of substituents bound to silicon atoms represents phenyl groups, and the resin A thermally deforms at a temperature of 30°C or higher but lower than the thermosetting initiation temperature of this composition. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
