| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed board in which solder bridge between a land and a reserved land arranged in close proximity to each other can be prevented certainly, and the lands and reserved lands can be formed with high density. SOLUTION: In the printed board 10, a plurality of lands 12 and a plurality of reserved lands 14 are formed on a substrate body 11 and the periphery of each land 12, and reserved land 14 are covered with solder resist 16. The land 12 and reserved land 14 are arranged in close proximity to each other, and each reserved land 14 is coated with solder resist 16a. The solder resist 16 covering the periphery of the reserved land 14 and the solder resist 16a covering the reserved land 14 are applied simultaneously. COPYRIGHT: (C)2007,JPO&INPIT
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