| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide resin having excellent dimensional stability to the variation of the surrounding humidity and to the thermal change and allowing efficient and reliable etching with an aqueous alkali solution. SOLUTION: The polyimide is obtained from a diamino compound at least 50 mol% of which is bis(4-aminophenyl)terephthalate and tetracarboxylic acid dianhydride at least 50 mol% of which is pyromellitic acid dianhydride. It has a coefficient of linear thermal expansion of≤9 ppm/K, a coefficient of moisture absorption of≤1.5% and an etching rate at 80°C with an aqueous potassium hydroxide solution of≥5μm/min. COPYRIGHT: (C)2007,JPO&INPIT
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