发明名称 MANUFACTURING METHOD OF METAL WIRING BOARD AND MANUFACTURING METHOD OF LIQUID JET HEAD
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a metal wiring board and a manufacturing method of a liquid jet head which accurately form a metal wiring of a prescribed shape in a prescribed position of a substrate. SOLUTION: The metal wiring board manufacturing method forms a metal wiring portion by forming a metal plated layer 93 made up of a metal material at least on a metal wiring base layer 900 by a plating method and then patterning the metal wiring base layer 900 and the metal plated layer 93 into a prescribed shape on the basis of an alignment mark portion 450 as a positioning reference by image recognition after forming the metal layer made up of the metal material on one side of the base substrate and forming the metal plated layer 93 made up of the metal material and the alignment mark portion 450 by patterning the metal layer into a prescribed shape and the liquid jet head manufacturing method applies the metal wiring board manufacturing method. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007245660(A) 申请公布日期 2007.09.27
申请号 JP20060075485 申请日期 2006.03.17
申请人 SEIKO EPSON CORP 发明人 ONODERA TOSHIYA
分类号 B41J2/16 主分类号 B41J2/16
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