发明名称 GRINDING METHOD OF NON-CONDUCTIVE WORKPIECE AND DEVICE THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a grinding method of a non-conductive workpiece and a device thereof capable of highly accurately grinding the non-conductive workpiece with a grinding wheel. SOLUTION: In the grinding method of the non-conductive workpiece for grinding the non-conductive workpiece W on a table 19 with the grinding wheel 15, a conductive simulated body 21 is mounted on the non-conductive workpiece, the grinding wheel having at least electrical conductivity is lowered to approach the conductive simulated body, and the conduction due to a contact between the conductive simulated body and the grinding wheel is detected. A conductive detecting position by the conduction is detected as a workpiece grinding start position on which the amount of a thickness of the conductive simulated body is added. The workpiece is raised, returned to a stand-by position, and separated from the conductive simulated body. After the conductive simulated body is taken out from the non-conductive workpiece, the grinding wheel is lowered from the stand-by position to the workpiece grinding start position to start the grinding of the non-conductive workpiece. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007245315(A) 申请公布日期 2007.09.27
申请号 JP20060074603 申请日期 2006.03.17
申请人 TAIWA SEISAKUSHO:KK 发明人 SAKAGAMI KOJI
分类号 B24B47/22;B24B7/22;B24B49/00;B24B55/06 主分类号 B24B47/22
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