摘要 |
PROBLEM TO BE SOLVED: To provide a resinoid grinding wheel using polyimide resin, having high heat resistance and having hardness and elastic modulus equal to or more than phenol resin. SOLUTION: This resinoid grinding wheel has a structure in which abrasive grain is held by an organic binder. The organic binder is made of bismaleimide resin and aminophenol curing agent. In a desired mode of this invention, the bismaleimide resin is heterocyclic compound including a methylene bond. In a more desired mode of the invention, the bismaleimide resin is N,N'-(4,4'-diphenylmethane) bismaleimide and the curing agent is p-aminophenol. COPYRIGHT: (C)2007,JPO&INPIT
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