发明名称 Laserbearbeitungsmaschine und Laserbearbeitungsverfahren
摘要 There is provided a laser machining apparatus, and a laser machining method using the same, which allow an installation area thereof to be reduced while improving its working efficiency. The laser machining apparatus comprises a body portion (A) having a plurality of laser irradiating sections (10a and 10b) and work mounting sections (3); a supplying stocker (20) for supplying workpieces (4); and a discharging stocker (60) for discharging the workpieces (4). The laser machining apparatus further comprises a supply-side transfer unit (B) having work retaining means (16a, 16b) capable of attaching/detaching the workpieces (4) and of the same number with the laser irradiating sections (10a, 10b), andmoving the work retaining means in the horizontal direction; and a discharge-side transfer unit (C) having work retaining tables (56a, 56b) capable attaching/detaching the workpieces (4) and of the same number with the laser irradiating sections (10a, 10b), and moving the work retaining tables (56a, 56b) in the vertical and horizontal directions. The supply-side transfer unit causes the plurality of supply-side work retaining tables (16a, 16b) to adsorb the workpieces (4) from the supplying stocker (20) one after another and moves these supply-side work retaining tables to the work mounting sections (3) to place the workpieces (4) thereon. The discharge-side unit causes the discharge-side work retaining tables (56a, 56b) to adsorb the workpieces (4) which have been machined on the work mounting sections (3) to move and discharge those workpieces (4) to the discharging stocker (60). <IMAGE>
申请公布号 DE602004003436(T2) 申请公布日期 2007.09.27
申请号 DE20046003436T 申请日期 2004.08.18
申请人 HITACHI VIA MECHANICS LTD. 发明人 ITO, YASUSHI;NARUSE, FUTAO;MARUYAMA, OSAMU
分类号 B23K26/10;B65H5/10;B23K26/08;B23K26/42;B23K37/047;B23Q7/14;B65H3/08;B65H29/32 主分类号 B23K26/10
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