| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device and a method for manufacturing it by eliminating any void or internal residual stress between wiring layers. <P>SOLUTION: A semiconductor device is provided with a plurality of wiring boards having members (11, 21, 31) for vertical connection on which one or more semiconductor elements are mounted; insulating layers (13, 23, 33) interposed between the plurality of wiring boards; a laminate in which they are mutually laminated; and a surface layer board (45) laminated in the uppermost layer of the laminate, and equipped with a recessing or projecting trace (46) on the surface. A method for manufacturing the semiconductor device is provided to hold the laminate configurations between metallic molds (100, 200) for carrying out heating and pressurization in its non-contact status on the pressurization face, and to heat and pressurize the laminate configurations by the metallic molds in a pressure reduction status, and to connect the boards by the members for connection, and to form the insulating layers by melting the insulating materials between the boards. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
