ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT-MOUNTED DEVICE, AND THEIR MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an electronic component 107 which has a hybrid laminated structure including a ceramic substrate 101 and has an excellent anti-shock property and a high electric connection reliability of secondary mounting, and also to provide an electronic component-mounted device.

SOLUTION: The electronic component 107 comprises: the ceramic substrate 101 having a wiring pattern; a resin sheet 103 which is bonded to one principal plane of the ceramic substrate 101, has via-hole conductors 105 consisting of a conductive resin composition and external electrodes 104, and electrically connects the external electrodes 104 and the wiring pattern 102 by the via-hole conductors 105; and a cushioning resin wall 106 formed on the external side face of the resin sheet 103.

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