发明名称 INSULATING COIL, DEVICE OF CURING RESIN, AND METHOD OF CURING RESIN
摘要 PROBLEM TO BE SOLVED: To suppress the generation of voids at the time of curing impregnated resin carried for forming an insulating coil. SOLUTION: There provided are a curing device having heating means for heating an insulating coil 1, a cooling means for cooling piping 33a for supplying resin to the insulating coil 1, and a temperature distribution control means for setting the temperature of the piping 33a to the temperature of the insulating coil 1 or lower, and a curing method for curing the resin by heating the insulating coil 1, cooling the supply path of the resin to the insulating coil 1 to the temperature of the insulating coil 1 or lower, and applying pressure on the resin. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007251184(A) 申请公布日期 2007.09.27
申请号 JP20070107193 申请日期 2007.04.16
申请人 TOSHIBA CORP;TOSHIBA AITEKKU KK 发明人 HIRAI HISASHI;MURATA KIYOKO;MUKAI TAMIKO
分类号 H01F5/06;B29C39/10;B29C39/22;B29C39/26;H01F6/06;H01F27/32;H01F41/12 主分类号 H01F5/06
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