发明名称 |
INSULATING COIL, DEVICE OF CURING RESIN, AND METHOD OF CURING RESIN |
摘要 |
PROBLEM TO BE SOLVED: To suppress the generation of voids at the time of curing impregnated resin carried for forming an insulating coil. SOLUTION: There provided are a curing device having heating means for heating an insulating coil 1, a cooling means for cooling piping 33a for supplying resin to the insulating coil 1, and a temperature distribution control means for setting the temperature of the piping 33a to the temperature of the insulating coil 1 or lower, and a curing method for curing the resin by heating the insulating coil 1, cooling the supply path of the resin to the insulating coil 1 to the temperature of the insulating coil 1 or lower, and applying pressure on the resin. COPYRIGHT: (C)2007,JPO&INPIT |
申请公布号 |
JP2007251184(A) |
申请公布日期 |
2007.09.27 |
申请号 |
JP20070107193 |
申请日期 |
2007.04.16 |
申请人 |
TOSHIBA CORP;TOSHIBA AITEKKU KK |
发明人 |
HIRAI HISASHI;MURATA KIYOKO;MUKAI TAMIKO |
分类号 |
H01F5/06;B29C39/10;B29C39/22;B29C39/26;H01F6/06;H01F27/32;H01F41/12 |
主分类号 |
H01F5/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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