| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor apparatus with high joint reliability of a semiconductor element and a substrate. SOLUTION: The epoxy resin composition contains an epoxy resin main agent 1, a cation polymerization initiator 2, a neutralizing agent 3 covered with a resin film, an inorganic filler 4 and a coupling agent 5. Further, the manufacturing method for the semiconductor apparatus comprises a step for preparing the epoxy resin composition of the present invention, the substrate provided with an electrode and the semiconductor element provided with an electrode, a step for coating the electrode of the substrate with the epoxy resin composition, a step for irradiating the coated epoxy resin composition with a UV ray, a step for joining the electrode of the semiconductor element to the electrode of the substrate coated with the epoxy resin composition irradiated with the UV ray, and a step for heating the epoxy resin composition in the state that the electrode of the substrate and the electrode of the semiconductor element are joined to each other. COPYRIGHT: (C)2007,JPO&INPIT |
