| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board which easily achieves high density wiring, and advantageously suppresses the occurrence of peeling or cracks, diffusion of metal ion in a filler, and corrosion of the filler by the laser beam. SOLUTION: In this multilayer printed wiring board having such a structure that a conductive circuit is formed on a substrate through a resin insulating interlayer, a through-hole is provided in the substrate, and the through-hole is filled with filler, a conductive layer is formed, which covers a surface the filler exposed from the through-hole directly above the through-hole and is made of an electroless plating film and an electrolytic plating film on the electroless plating film, and a roughened layer is formed on an inner wall of the through-hole. COPYRIGHT: (C)2007,JPO&INPIT |
