发明名称 SUBSTRATE MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To simultaneously manufacture substrates with different thickness or different numbers of layers within the same work through a substrate manufacturing method for manufacturing substrates. SOLUTION: When manufacturing a substrate by laminating a plurality of elements (core materials 1a, 1b, 3a, 3b, prepregs 2a-2c, copper foils 4a-4d, removers 5a, 5b and inner layer patterns 11a-11c, 12a-12j); a substrate surface is divided into a plurality of areas, the removers 5a, 5b are provided in a plurality of elements laminated within at least one area, the substrate is divided for each area after laminating and pressing the substrate, and the substrate is manufactured with the less number of layers by removing unwanted portions using the removers in the area where the removers are provided, in comparison with the area in which the removers are not provided. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007250976(A) 申请公布日期 2007.09.27
申请号 JP20060074511 申请日期 2006.03.17
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 MINOSHIMA HISAHIRO
分类号 H05K3/00;H05K3/46 主分类号 H05K3/00
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