| 摘要 |
PROBLEM TO BE SOLVED: To provide a strong connection structure capable of grounding reliably of a circuit board having an improved shielding effect and a frame body. SOLUTION: In the connection structure between the circuit substrate and the frame body, a gap for increasing a capillary phenomenon is formed between a solder reinforcing body 5 and the frame body 1, and between the solder reinforcing body 5 and a land 3a due to the presence of the solder reinforcing body 5. Solder 6 flows into the gap to reinforce the connection structure between the frame body 1 and the solder reinforcing body 5, and between the land 3a and the solder reinforcing body 5. Also, the solder 6 can connect the frame body 1 and a wall 1d positioned at both the sides of the land 3a and the opening 1a for grounding reliably even if it is applied to a high-frequency unit. COPYRIGHT: (C)2007,JPO&INPIT
|
