| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor-element mounting substrate, whereby each bump of a semiconductor element and each electrode of a circuit substrate can be jointed to each other with a high jointing strength, without damaging the semiconductor element. SOLUTION: The method of manufacturing the semiconductor-element mounting substrate has mounted a semiconductor element 10, having bumps 11 made of gold on a circuit substrate 22 having electrodes 21 at least whose surfaces are made of gold. This manufacturing method has a process of so coating the surface of each bump 11 and/or the surface of each electrode 21 with a coating liquid in whose dispersion medium metal particles are dispersed as to form each coating film, a process for contacting each bump 11 and each electrode 21 with each other via each coating film, and a process for so applying an ultrasonic wave to each bump 11 and each electrode 21, in a state of contacting them with each other as to joint them to each other. The quantity per unit area A (g/cm<SP>2</SP>) of the metal particles, interposed between each bump 11 and each electrode 21, falls within a specific range in the process of jointing bumps 11 and electrodes 21 to each other. COPYRIGHT: (C)2007,JPO&INPIT |
