发明名称 Film resistor embedded in multi-layer circuit board and manufacturing method thereof
摘要 A resistor structure embedded in a multi-layer circuit board and manufacturing method thereof are provided. Resistive material is coated on any layer among the multi-layer circuit board, and two symmetric electrodes are formed in the geometric center of the resistive material area. The two electrodes are disposed in the resistive material layer and are covered by the resistive material. And the two electrodes are led out from respective bores at the central position of the resistive electrodes, for connecting to any other metal layer. This resistor structure can avoid the unstable resistance when the coated resistor is operated at high frequency, and also avoid the formation untrimmed edges during coating that affects the precision of resistance.
申请公布号 US2007222551(A1) 申请公布日期 2007.09.27
申请号 US20060485785 申请日期 2006.07.12
申请人 LAI YING-JIUNN;SHYU CHIN-SUN;CHEN CHANG-SHENG;JOW UEI-MING 发明人 LAI YING-JIUNN;SHYU CHIN-SUN;CHEN CHANG-SHENG;JOW UEI-MING
分类号 H01C1/012 主分类号 H01C1/012
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