发明名称 MULTI-LAYER CIRCUIT BOARD HAVING GROUND SHIELDING WALLS
摘要 A circuit board includes a plurality of signal lines and a plurality of shielding walls. The shield walls are disposed between the signal lines. Each shield wall includes an upper surface, a lower surface, a rectangular groove, a first metal layer and a second metal layer. The lower surface is opposite to the upper surface. The rectangular groove extends from the upper surface to the lower surface. The first metal layer is disposed on the upper surface. The second metal layer is disposed in the rectangular groove and electrically connected to the first metal layer.
申请公布号 US2007221405(A1) 申请公布日期 2007.09.27
申请号 US20070620444 申请日期 2007.01.05
申请人 ADVANCED SEMICONDUCTOR ENGINEERING, INC. 发明人 CHENG HUNG-HSIANG
分类号 H01R12/04;H05K1/11 主分类号 H01R12/04
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