发明名称 MULTILAYER PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To obtain a multilayer printed wiring board that allows a characteristic impedance of a signal-transmission through-hole provided in the multilayer printed wiring board to be set within a desired range. SOLUTION: An inter-center distance D(m) between the signal-transmission through-hole 1 and each of two ground through-holes 3, 4, a hole diameter a(m) of the signal-transmission through-hole, and a distance r(m) between the signal-transmission through-hole 1 and a clearance hole 6 are set so that the characteristic impedance Z of the signal-transmission through-hole 1 is included in a setting range to characteristic impedances Z<SB>b</SB>(Ω) of first/second transmission lines 2, 9. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007250885(A) 申请公布日期 2007.09.27
申请号 JP20060073106 申请日期 2006.03.16
申请人 AICA KOGYO CO LTD 发明人 HIGASHIURA KENICHI;IKEDA SATOSHI;TANAKA AKIHIRO
分类号 H05K3/46 主分类号 H05K3/46
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