| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin sealing molding device of a semiconductor chip which improves productivity in a molding process furthermore by coupling a required number of arrangement constitutions wherein one substrate is subjected to compression molding to a pair of compressing molding dies after consistently effectively and smoothly carrying out processes before and after a molding process in a production line such as a pre (bonding) process and a post (dicing) process. SOLUTION: In the device 1, a required number of chips 15 fitted to one substrate 14 are subjected to resin sealing by compression molding to a pair of molds 5 by combinedly using evacuation molding in addition to the molding of a release film 36 by a pair of compression molding molds 5, that is, the mold 5 of a constitution of three molds (33, 34 and 35), and a required number of pairs of compression molding molds 5 (press unit 7) are arranged while being coupled. COPYRIGHT: (C)2007,JPO&INPIT |
