| 摘要 |
PROBLEM TO BE SOLVED: To provide a molded electronic component which is easily provided with a through-hole and reliable without having a blister of coating resin, coating cracking, etc., due to solder heat and can be made thin; and to provide a method of manufacturing the same. SOLUTION: The molded electronic component formed by molding a coil component 1 having a core 2 with the coating resin 3 has a recess 3b formed in the coating resin 3 on the core 2 of the coil component 1 without reaching the surface 1a of the core, and also has the through-hole 3a bored in the bottom 3c of the recess by using a laser etc. COPYRIGHT: (C)2007,JPO&INPIT
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