| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology for transferring an adhesive layer on a circuit board without remaining on a peeled film. SOLUTION: The adhesive part 18 is formed by applying a liquid component on the surface of the adhesive layer 15 before bonding the adhesive layer 15 on the circuit board 20 and a resin component 16 in the adhesive layer 15 is dissolved or swollen. Since the adhesive part 18 has a high bonding property to the circuit board 20, the adhesive layer 15 is strongly bonded with the circuit board 20 through the adhesive part 18. On the other hand, since on the surface of a peeling film 11 side of the adhesive layer, the liquid component does not penetrated yet, the peeling film 11 side of the adhesive layer 15 is a solid at a normal temperature. Therefore on peeling off the peeling film 11, the peeling occurs at the boundary of the peeling film 11 and the adhesive layer 15, the adhesive layer 15 does not remain on the peeled film 11. COPYRIGHT: (C)2007,JPO&INPIT
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