| 摘要 |
PROBLEM TO BE SOLVED: To provide a cover tape for packaging a semiconductor device and a wrapper for a semiconductor device, which protect an outer shape of the semiconductor device, assure both quality and reliability of the semiconductor device, and improve an actual installation speed of the semiconductor through a taping shipment. SOLUTION: The cover tape for packaging a semiconductor device of the present invention is bonded to cover a plurality of storing segments in an embossed tape having the storing segments for storing the semiconductor device, and a net structure 20 is arranged in at least a part of it. The wrapper for the semiconductor is comprised of the embossed tape having a plurality of storing segments for storing the semiconductor and the cover tape for packaging the semiconductor device. COPYRIGHT: (C)2007,JPO&INPIT
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