发明名称 Method of forming resist pattern and method of maufacturing semiconductor device
摘要 The present invention improves the OPE characteristic generated by the difference between sparse and dense mask patterns and promotes fidelity in the design of the pattern. Because of this, the present invention includes a step of forming a resist having an acid dissociative dissolution suppression group on a substrate, a step of coating the resist with an acid polymer dissolved in an alcohol based solvent and forming an upper layer film, a step of exposing through a mask, a step of performing a baking process, and a step of processing with an alkali developer, and wherein in the step of performing a baking process, a mixing layer is formed on the resist by the upper layer film and in which a thicker mixing layer is formed in an unexposed part of a region where the pattern density of the mask pattern is high compared to a region where the pattern density is low.
申请公布号 US2007224546(A1) 申请公布日期 2007.09.27
申请号 US20070700131 申请日期 2007.01.31
申请人 RENESAS TECHNOLOGY CORP. 发明人 SUGANAGA TOSHIFUMI;HANAWA TETSURO;ISHIBASHI TAKEO
分类号 G03F7/26 主分类号 G03F7/26
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