ELECTRONIC PACKAGE STRUCTURES USING LAND GRID ARRAY INTERPOSERS FOR MODULE-TO-BOARD INTERCONNECTION

摘要

Apparatus and methods are provided for constructing electronic package structures using LGA (land grid array) module-to-board connectors that are designed to provide higher count I/O interconnections by expanding LGA area, but without having to increase chip module footprint or reduce the pitch of area array I/O contacts of an LGA interposer or circuit board beyond practical limits.