发明名称 METHOD AND COMPOSITION FOR ELECTRO-CHEMICAL-MECHANICAL POLISHING
摘要 Methods and compositions for electro-chemical-mechanical polishing (e-CMP) of silicon chip interconnect materials, such as copper, are provided. The methods include the use of compositions according to the invention in combination with pads having various configurations.
申请公布号 WO2006088533(A3) 申请公布日期 2007.09.27
申请号 WO2005US43464 申请日期 2005.12.02
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION;ANDRICACOS, PANAYOTIS, C.;CANAPERI, DONALD, F.;COOPER, EMANUEL, I.;COTTE, JOHN, M.;DELIGIANNI, HARIKLIA;ECONOMIKOS, LAERTIS;EDELSTEIN, DANIEL, C.;FRANZ, SILVIA;PRANATHARTHIHARAN, BALASUBRAMANIAN;KRISHNAN, MAHADEVAIYER;MANSSON, ANDREW, P.;WALTON, ERICK, G.;WEST, ALAN, C. 发明人 ANDRICACOS, PANAYOTIS, C.;CANAPERI, DONALD, F.;COOPER, EMANUEL, I.;COTTE, JOHN, M.;DELIGIANNI, HARIKLIA;ECONOMIKOS, LAERTIS;EDELSTEIN, DANIEL, C.;FRANZ, SILVIA;PRANATHARTHIHARAN, BALASUBRAMANIAN;KRISHNAN, MAHADEVAIYER;MANSSON, ANDREW, P.;WALTON, ERICK, G.;WEST, ALAN, C.
分类号 B23H3/00 主分类号 B23H3/00
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