Verfahren zur Verbindung integrierter Schaltungen

摘要

The second integrated circuit (C2) is mounted above the first integrated circuit (C1) in a housing (VK). The bottom of the housing is closed by a substrate (P) with contacts (PKF) at the bottom. Connectors (80) extend from the first integrated circuit to bonding pads (BP') on the substrate. The space between the first and second integrated circuits is filled with an adhesive material (300). Flexible contacts on the underside of the second integrated circuit touch flexible contacts on the upper side of the first integrated circuit.