| 摘要 |
A process for producing a multilayer wiring board, comprising the steps of forming an insulating layer on a base material furnished with interlayer connection bumps, interposing the resultant mass between stainless steel plates and performing thermal compression bonding of a copper foil on the insulating layer, and patterning the copper foil. In the thermal compression bonding of a copper foil, a metal foil is interposed at least between the copper foil and each of the stainless steel plates. In this step, the interposed metal foil at the surface is provided with a mold release layer. Consequently, sticking of the product after molding (copper foil bonding) to the stainless steel plate can be prevented, and there can be obtained a multilayer wiring board that is free from occurrence of wrinkle and ruggedness and excels in dimensional stability. |
