| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring structure of LSI reducing wiring capacitance C and wiring delay RC. SOLUTION: In a wiring structure having multilayered wiring layers, dielectric ratio of an insulating layer between wirings in a wiring width direction is relatively higher than the one in a wiring thickness direction in an upper wiring layer and the dielectric ratio of the insulating layer between wirings in the wiring thickness direction is relatively higher than the one in the wiring width direction in a lower wiring layer. COPYRIGHT: (C)2007,JPO&INPIT |
