| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor laser module which is further improved in bonding reliability by carrying out bonding without producing low melting point layer, in the case of bonding by laser welding. SOLUTION: The semiconductor laser module is constituted such that: a sealing member stores a base, where a semiconductor laser element consisting of a first metal material is laid, or the semiconductor laser element; a lens holder consisting of a second metal material holds a lens to which the light emitted from the semiconductor laser element is led; and the sealing member and the lens holder are connected via a connection member consisting of a third metal material. The first metal material is a Fe-nickel-Co system alloy, the second metal material where Pb element, Te element, and S element are added, and also Ni element exists in inescapable impurities concentration is a ferrite system stainless alloy excellent in a free-machining property, and the third metal material is a ferrite system stainless alloy where Ni element, Pb element, Te element, and S element exist in inevitable impurities concentration. COPYRIGHT: (C)2007,JPO&INPIT
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