| 摘要 |
PROBLEM TO BE SOLVED: To provide a bump inspection device and a bump inspection method capable of shortening an inspection time. SOLUTION: This bump inspection device/method is provided with a stage movable along the first direction x, the first and second line sensors for imaging a one-dimensional image along the second direction y, the first oblique light illumination means for oblique-illuminating an imaging area of the first line sensor from a direction inclined with respect to the second direction y at an elevation angle smaller than 90°, and the second oblique light illumination means for oblique-illuminating an imaging area of the second line sensor from a direction opposed to the oblique illumination direction of the first oblique light illumination means at the elevation angle same to that in the first oblique light illumination means. COPYRIGHT: (C)2007,JPO&INPIT
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