发明名称 ELECTRONIC PART MOUNTING CIRCUIT BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide an electronic part mounting circuit board which has cavities on both faces capable of obtaining the high density in wiring conductors and the high density mounting of electronic parts, and of which the manufacturing method is simple. <P>SOLUTION: This electronic part mounting circuit board is provided with a laminated ceramic circuit board 10 which is constituted by making internal wiring conductors 3 intermediate between layers and by laminating a plurality of ceramic layers 1a-1f, and formed with the cavities 2a, 2f of concave shape different from each other on one principal plane and another principal plane facing the one principal plane, and the electronic parts 5a, 5f mounted in the cavities 2a, 2f, respectively. The laminated ceramic circuit board 10 is formed so that a cavity 2a of the one principal plane is located within a formation region of a cavity 2f of the another principal plane in a perspective plane view and is in a back-to-back state to a cavity 2f of the another principal plane through an intermediate layered-product 10b. Thus, the electronic parts are mounted with high density in the laminated ceramic circuit board of which the manufacturing method is simple. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007251192(A) 申请公布日期 2007.09.27
申请号 JP20070122634 申请日期 2007.05.07
申请人 KYOCERA CORP 发明人 SAKANOUE AKIHIRO;ODA TSUTOMU;HISATAKA MASAFUMI
分类号 H05K3/46;H01L23/13 主分类号 H05K3/46
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