| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive composition improved in pattern collapse property and development defects even in forming a fine pattern of 100 nm or less, and to provide a patterning method using the composition. <P>SOLUTION: The positive photosensitive composition is used for processes of manufacturing semiconductors such as an IC, manufacturing circuit boards of liquid crystals, thermal heads or the like and for other photofabrication processes, and the composition comprises (A) a compound which generates an acid by irradiation with active rays or radiation and (B) two kinds of resins having a repeating unit having a hydroxyl group. The patterning method is carried out by using the composition. <P>COPYRIGHT: (C)2007,JPO&INPIT |
