| 发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION, ARTICLE AND NEGATIVE PATTERN FORMING METHOD |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which can be developed with basic aqueous solution by using a polymer precursor soluble in basic aqueous solution. <P>SOLUTION: The photosensitive resin composition for development with the basic aqueous solution contains an intramolecular-cleavable compound (A) which generates a basic substance by a cleavage reaction of an intramolecular covalent bond by absorption of electromagnetic waves and the polymer precursor soluble in basic aqueous solution. <P>COPYRIGHT: (C)2007,JPO&INPIT |
| 申请公布号 |
JP2007249017(A) |
申请公布日期 |
2007.09.27 |
| 申请号 |
JP20060075011 |
申请日期 |
2006.03.17 |
| 申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
SAKAYORI KATSUYA;FUKUDA TOSHIHARU |
| 分类号 |
G03F7/004;G02B5/20;G03F7/037;G03F7/38;H01L21/027 |
主分类号 |
G03F7/004 |
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