发明名称 PHOTOSENSITIVE RESIN COMPOSITION LAYER, PHOTOSENSITIVE ELEMENT USING SAME, RESIST PATTERN FORMING METHOD, AND METHOD FOR PRODUCING PRINTED WIRING BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition layer which satisfies both of high sensitivity and high resolution, and ensures an excellent resist profile. <P>SOLUTION: The photosensitive resin composition contains (A) a binder polymer, (B) a photopolymerizable compound having an ethylenically unsaturated bond and (C1) a pyrazoline compound represented by the formula (1). <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007248590(A) 申请公布日期 2007.09.27
申请号 JP20060069006 申请日期 2006.03.14
申请人 HITACHI CHEM CO LTD 发明人 MIYASAKA MASAHIRO;KUMAKI TAKASHI
分类号 G03F7/004;G03F7/031;H01L21/027 主分类号 G03F7/004
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