| 摘要 |
PROBLEM TO BE SOLVED: To provide a protective structure of a semiconductor wafer, wherein the back of the wafer extremely thinly is ground without curving the wafer by fully supporting it, and the wafer is not damaged when removing it from a fixing jig, and also to provide a grinding method of the semiconductor wafer using the protective structure. SOLUTION: In the protective structure of the semiconductor wafer, the semiconductor wafer 1, and a pressure-sensitive adhesive sheet 2 and the fixing jig 3 laminated on the circuit surface of the semiconductor wafer 1 are laminated in this order. The fixing jig 3 comprises: a jig substrate 30, having a plurality of projections 36 on one surface and a sidewall 35 that has nearly the same height as that of the projections 36 at the outer-periphery section on one surface; and an adhesive layer 31 that is laminated on a surface having the projections 36 on the jig substrate 30 and is bonded on the upper surface of the sidewall 35. A divided space 37 is formed on a surface having the projections 36 of the jig substrate 30 by the adhesive layer 31, the projections 36, and the sidewall 35. At least one through hole 38 penetrating the outside and the divided space 37 is provided in the jig substrate 30. The adhesive layer 31 is laminated on the surface of the pressure-sensitive adhesive sheet 2. COPYRIGHT: (C)2007,JPO&INPIT |
