SUBSTRATE FIXING STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide an inexpensive structure excellent in heat dissipation property and capable of adjustment of each element even after a substrate is assembled in a connection structure of the substrate and a heat sink. SOLUTION: In the substrate fixing structure, the substrate 30 includes an electronic and electric element 20 on one surface thereof. The substrate 30 is disposed on a heat sink 60 and includes a spacer pattern 10 formed between the substrate 30 and the heat sink 60. The spacer pattern 10 and a sealing member 12 are disposed between the substrate 30 and the heat sink 60. The element 20 can be changed in its element constant after assembling of the substrate, as a printed resistance. COPYRIGHT: (C)2007,JPO&INPIT