| 摘要 |
PROBLEM TO BE SOLVED: To provide a method using a wet surface preparation and a direct bonding technique on a composite having a micro-electro-mechanical system by improving the decision of an existing technique. SOLUTION: The method is used for manufacturing structure of the micro-electro-mechanical system (MEMS) inside a sealing cavity 38 of a microelectronic device 50, wherein a prepared cover 30 is bonded to a substrate 10 by a silicon direct bonding (SDB). A MEMS structure 22 bonds to a base 12 with a sacrifice intermediate layer 16 without impairing characteristics of the MEMS structure 22, i.e. without performing deposition, in order to optimize the preparation of the surface by wet cleaning, and without releasing the MEMS structure 22 during bonding. The bonding is performed by injecting a HF gaseous phase through at least one vent 40 opening to the cavity 38, thereafter removing the layer. COPYRIGHT: (C)2007,JPO&INPIT |
