发明名称 CONNECTION STRUCTURE OF FLEXIBLE SUBSTRATE, CONNECTION STRUCTURE OF OPTICAL PICKUP FLEXIBLE SUBSTRATE, AND OPTICAL DISK DRIVING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a structure capable of easily executing repair connection so as to reduce connection failures in the connection of a first flexible substrate fixed to the main body of a thin optical pickup device and a second flexible substrate inserted into the connector of a drive. SOLUTION: In the solder connection of a first flexible substrate fixed to an optical pickup device main body with a second flexible substrate inserted into the connector of a drive side, a solder dam is provided in the tip of the wiring of the first flexible substrate for securing a predetermined solder amount for reconnection when a solder connected part is heated again to remove the second flexible substrate from the first flexible substrate, and the end of the wiring of the second flexible substrate is narrowed. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007250028(A) 申请公布日期 2007.09.27
申请号 JP20060068734 申请日期 2006.03.14
申请人 HITACHI MEDIA ELECTORONICS CO LTD 发明人 NOMURA RIKA;FURUICHI HIROO;ARAI SATOSHI;HIRAMATSU HIROMICHI;SATAKE MITSUO;ITO KAZUHIKO
分类号 G11B7/13;G11B7/09;G11B33/12 主分类号 G11B7/13
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