| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroless gold-plating bath which deposits gold adequately selectively on a metallic part formed on a ceramic material, hardly deposits gold on a part outside the pattern, hardly causes its own decomposition or sedimentation, and has superior stability. SOLUTION: The electroless gold-plating liquid is an aqueous solution including (i) a water-soluble gold compound, (ii) a complexing agent, (iii) a reducing agent, and (iv) a compound shown by the formula in the following figure, wherein R<SP>1</SP>and R<SP>2</SP>are the same or different, and are a lower alkyl group or a hydrogen atom, wherein the lower alkyl group may include at least one group selected from the group consisting of a benzyl group, a phenyl group, a halogen atom, a group: -N(R<SP>3</SP>)<SB>2</SB>(wherein R<SP>3</SP>is a hydrogen atom or a lower alkyl group), a group: -SO<SB>3</SB>M<SP>1</SP>(wherein M<SP>1</SP>is a hydrogen atom or an alkali metal), a hydroxyl group, a group: -O(CH<SB>2</SB>)<SB>n</SB>-OH (n=2 or 3), a cyano group, a nitro group, a phosphonic group, and a phenyl group. COPYRIGHT: (C)2007,JPO&INPIT
|
