发明名称 |
WÄRMEHÄRTBARE KLEBSTOFFZUSAMMENSETZUNG, GEGENSTAND, HALBLEITERVORRICHTUNG UND VERFAHREN |
摘要 |
Provided are a heat curable adhesive composition and an adhesive article suited for dicing of a semiconductor and die-bonding of the diced semiconductor chip, and a semiconductor apparatus and a process for preparing a semiconductor apparatus using the adhesive composition and article. In one embodiment, the present invention provides a heat curable adhesive composition comprising a caprolactone-modified epoxy resin and a tack reducing component. Another embodiment of the present invention provides an adhesive article comprising a heat curable adhesive layer of a heat curable adhesive composition comprising a caprolactone-modified epoxy resin, a tack reducing component, and a backing layer carrying said adhesive layer on at least a portion of the backing layer. |
申请公布号 |
DE60315650(D1) |
申请公布日期 |
2007.09.27 |
申请号 |
DE2003615650 |
申请日期 |
2003.06.23 |
申请人 |
3M INNOVATIVE PROPERTIES CO. |
发明人 |
TAKEUCHI, SHOJI;KAWATE, KOHICHIRO;SAKAKIBARA, MAKOTO |
分类号 |
B32B27/00;C09J163/00;C08L21/00;C08L25/14;C08L33/00;C08L71/12;C08L79/08;C09J7/02;C09J11/00;H01L21/00;H01L21/301;H01L21/52;H01L21/58;H01L21/68;H01L21/683;H01L21/78;H01L23/31 |
主分类号 |
B32B27/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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