<p>Disclosed is an adhesive film having slippability which can be suitably used as an FPC board even when a dense circuit pattern is formed thereon. Specifically disclosed is an adhesive film obtained by arranging a thermoplastic polyimide layer on both sides of a highly heat-resistant polyimide layer. The highly heat-resistant polyimide layer as the center layer substantially contains no slipping material, while a slipping material having a median average particle size of 1-10 µm is uniformly dispersed in the thermoplastic polyimide layers. This slipping material existing in the thermoplastic polyimide layers is contained in the thermoplastic polyimide resin.</p>
